Name: EV-BC833E
Brand: Fanstel Corp.
SKU: DS-8552828
Price: 100 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $100.0000

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Fanstel Corp. EV-BC833E

EVAL BOARD FOR BC833E

Manufacturer # :EV-BC833E

Manufacturer :Fanstel Corp.

Dasenic # :EV-BC833E-DS

Datasheet :

EV-BC833E Datasheet

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Customer #

Description : EVAL BOARD FOR BC833E

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Quantity	Unit Price	Total
1+	$ 100.0000	$ 100

In Stock: 1504

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 100

Total :$ 100.00

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Payment :

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EV-BC833E information

Fanstel Corp. EV-BC833E technical specifications, attributes, parameters.
Category:RF and Wireless/RF Evaluation and Development Kits, Boards
Product Status:Active
For Use With/ Related Products:BC833E, nRf52833
Frequency:2.4GHz
Type:Transceiver; 802.15.4 (Thread, ZigBee®), Bluetooth® 5
Supplied Contents:Board(s)
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Fanstel Corp. EV-BC833E
Datasheet:
EV-BC833E,

Fanstel Corp. EV-BC833E Environmental and export classification status description

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

EV-BC833E provided by Fanstel Corp.

Fanstel Corp. was established in 1990 as a Caller ID products manufacturers. Our main business was making caller ID products for phone companies. A partial list of our customers: Verizon, AT&T (SBC), Sprint, British Telecom, Telmex (Mexico). Our products evolve from the original Caller ID boxes to VoIP solutions for enterprise, Android desktop phone, and specialized phones for the hearing impaired. We have the following capabilities in-house: Hardware engineering; Firmware engineering; iOS and Android OS app development; PCB layout, multiple layers, controlled impedance, 0.1mm buried vias; SMT line to handle 01005 passive components, BGA with 0.3mm pitch. As a vertically integrated manufacturer, we can continue using testing and field results to improve our production processes. Rework rate of our second generation modules (e.g., BT832) is in PPM (Part Per Million).