Name: BLG840F
Brand: Fanstel Corp.
SKU: DS-8581560
Price: 57.591 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $57.5910

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Fanstel Corp. BLG840F

BLG840F

Manufacturer # :BLG840F

Manufacturer :Fanstel Corp.

Dasenic # :BLG840F-DS

Datasheet :

BLG840F Datasheet

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Description : BLG840F

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Quantity	Unit Price	Total
1+	$ 57.5910	$ 57.59
50+	$ 57.5820	$ 2879.1

In Stock: 1682

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 57.591

Total :$ 57.59

Delivery :

Payment :

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BLG840F information

Fanstel Corp. BLG840F technical specifications, attributes, parameters.
Category:RF and Wireless/RF Receiver, Transmitter, and Transceiver Finished Units
Product Status:Active
Features:-
Frequency:2.4GHz
Sensitivity:-
Interface:I²C, I²S, SPI, UART, USB
Data Rate ( Max):125kbps
Power - Output:22.9dBm
Modulation or Protocol:802.15.4 Zigbee, Bluetooth v5.0
Applications:GPS, LTE
Function:Gateway
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for Fanstel Corp. BLG840F
Datasheet:
BLG840F,

Fanstel Corp. BLG840F Environmental and export classification status description

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

BLG840F provided by Fanstel Corp.

Fanstel Corp. was established in 1990 as a Caller ID products manufacturers. Our main business was making caller ID products for phone companies. A partial list of our customers: Verizon, AT&T (SBC), Sprint, British Telecom, Telmex (Mexico). Our products evolve from the original Caller ID boxes to VoIP solutions for enterprise, Android desktop phone, and specialized phones for the hearing impaired. We have the following capabilities in-house: Hardware engineering; Firmware engineering; iOS and Android OS app development; PCB layout, multiple layers, controlled impedance, 0.1mm buried vias; SMT line to handle 01005 passive components, BGA with 0.3mm pitch. As a vertically integrated manufacturer, we can continue using testing and field results to improve our production processes. Rework rate of our second generation modules (e.g., BT832) is in PPM (Part Per Million).