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Dialog Semiconductor SLG46826G
GPAK MIXED SIGNAL MATRIX
Manufacturer # :SLG46826G
Manufacturer :Dialog Semiconductor
Dasenic # :SLG46826G-DS
Datasheet :
SLG46826G Datasheet
SLG46826G DatasheetCustomer # :
Description : GPAK MIXED SIGNAL MATRIX
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 2.6280 | $ 2.63 |
| 10+ | $ 1.6632 | $ 16.63 |
| 25+ | $ 1.4119 | $ 35.3 |
| 100+ | $ 1.1273 | $ 112.73 |
| 250+ | $ 0.9874 | $ 246.85 |
In Stock: 11307
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.628
Total :$ 2.63
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SLG46826G information
Dialog Semiconductor SLG46826G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package:20-TSSOP
- Programmable Type:In System Programmable
- Delay Time tpd(1) Max:-
- Voltage Supply - Internal:1.71V ~ 2.5V, 2.3V ~ 5.5V
- Number of Logic Elements/ Blocks:-
- Number of Macrocells:19
- Number of I/ O:13
- Number of gates:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SLG46826G provided by Dialog Semiconductor
Founded in 1985, Dialog Semiconductor is a manufacturer established in the US and headquartered in Reading, UK, with a global sales, R&D and marketing organization.
In August 2021,Renesas Electronics Corporation (TSE:6723)Completed Acquisition of Dialog Semiconductor.
As a wholly owned subsidiary of Renesas Electronics Corporation, Dialog Semiconductor plc is a leading provider of standard and custom integrated circuits (ICs) that power the Internet of Things and Industry 4.0 applications.
Dialog’s proven expertise propels the next generation of today’s devices by providing Battery Management, Bluetooth® low energy, Wi-Fi, Flash memory, and Configurable Mixed-signal ICs, improving power efficiency, reducing charge times, while increasing performance and productivity on the go.
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