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Dialog Semiconductor RM24C512C-LTAI-T

IC CBRAM 512KBIT I2C 1MHZ 8TSSOP
part number has RoHS
Manufacturer # :RM24C512C-LTAI-T
Manufacturer :Dialog Semiconductor
Dasenic # :RM24C512C-LTAI-T-DS
Customer # :
Description : IC CBRAM 512KBIT I2C 1MHZ 8TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 1.4942$ 14.94
8000+$ 0.8301$ 6640.8
In Stock: 75
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.4942
Total :$ 1.49
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RM24C512C-LTAI-T information

  • Dialog Semiconductor RM24C512C-LTAI-T technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP (0.173", 4.40mm Width)
  • Technology:CBRAM
  • Supplier Device Package:8-TSSOP
  • Memory Size:512Kb (128B Page Size)
  • Memory Type:Non-Volatile
  • Voltage - Supply:1.65V ~ 3.6V
  • Clock Frequency:1 MHz
  • Access Time:-
  • Memory Format:CBRAM®
  • Memory Interface:I²C
  • Write Cycle Time - Word, Page:100µs, 5ms
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991B1A
  • HTS US:8542.32.0071
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
RM24C512C-LTAI-T provided by Dialog Semiconductor
Founded in 1985, Dialog Semiconductor is a manufacturer established in the US and headquartered in Reading, UK, with a global sales, R&D and marketing organization. In August 2021,Renesas Electronics Corporation (TSE:6723)Completed Acquisition of Dialog Semiconductor. As a wholly owned subsidiary of Renesas Electronics Corporation, Dialog Semiconductor plc is a leading provider of standard and custom integrated circuits (ICs) that power the Internet of Things and Industry 4.0 applications. Dialog’s proven expertise propels the next generation of today’s devices by providing Battery Management, Bluetooth® low energy, Wi-Fi, Flash memory, and Configurable Mixed-signal ICs, improving power efficiency, reducing charge times, while increasing performance and productivity on the go.
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