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Dialog Semiconductor DA7211-01UA6

IC CODEC STEREO 36-BUMP CSP
part number has RoHS
Manufacturer # :DA7211-01UA6
Manufacturer :Dialog Semiconductor
Dasenic # :DA7211-01UA6-DS
Customer # :
Description : IC CODEC STEREO 36-BUMP CSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.1240$ 2.12
10+$ 1.9080$ 19.08
100+$ 1.5300$ 153
250+$ 1.4400$ 360
500+$ 1.2600$ 630
In Stock: 5340
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.124
Total :$ 2.12
Delivery :
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DA7211-01UA6 information

  • Dialog Semiconductor DA7211-01UA6 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - CODECs
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:36-UFBGA, WLCSP
  • Type:Stereo Audio
  • Supplier Device Package:36-WLCSP (2.96x3.19)
  • Resolution ( Bits):-
  • Data Interface:I²S, PCM
  • Voltage - Supply, Analog:1.8V ~ 2.5V
  • Voltage - Supply, Digital:1.2V ~ 2.5V
  • Number of A D Cs / D A Cs:2 / 2
  • Sigma Delta:Yes
  • S/ N Ratio, A D Cs / D A Cs (db) Typ:96 / 100
  • Dynamic Range, A D Cs / D A Cs (db) Typ:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DA7211-01UA6 provided by Dialog Semiconductor
Founded in 1985, Dialog Semiconductor is a manufacturer established in the US and headquartered in Reading, UK, with a global sales, R&D and marketing organization. In August 2021,Renesas Electronics Corporation (TSE:6723)Completed Acquisition of Dialog Semiconductor. As a wholly owned subsidiary of Renesas Electronics Corporation, Dialog Semiconductor plc is a leading provider of standard and custom integrated circuits (ICs) that power the Internet of Things and Industry 4.0 applications. Dialog’s proven expertise propels the next generation of today’s devices by providing Battery Management, Bluetooth® low energy, Wi-Fi, Flash memory, and Configurable Mixed-signal ICs, improving power efficiency, reducing charge times, while increasing performance and productivity on the go.
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