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Dialog Semiconductor AT25DF512C-XMHNGU-B
Manufacturer # :AT25DF512C-XMHNGU-B
Manufacturer :Dialog Semiconductor
Dasenic # :AT25DF512C-XMHNGU-B-DS
Datasheet : AT25DF512C-XMHNGU-B Datasheet
Customer # :
Description : IC FLASH 512KBIT SPI 8TSSOP
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In Stock: 1806
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 1.9147
Total :$ 1.91
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AT25DF512C-XMHNGU-B information
Dialog Semiconductor AT25DF512C-XMHNGU-B technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TC)
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP (0.173", 4.40mm Width)
- Technology:Flash
- Supplier Device Package:8-TSSOP
- Memory Size:512Kb (64K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:1.65V ~ 3.6V
- Clock Frequency:104 MHz
- Access Time:-
- Memory Format:Flash
- Memory Interface:SPI
- Write Cycle Time - Word, Page:8µs, 3.5ms
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.32.0071
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AT25DF512C-XMHNGU-B provided by Dialog Semiconductor
Founded in 1985, Dialog Semiconductor is a manufacturer established in the US and headquartered in Reading, UK, with a global sales, R&D and marketing organization.
In August 2021,Renesas Electronics Corporation (TSE:6723)Completed Acquisition of Dialog Semiconductor.
As a wholly owned subsidiary of Renesas Electronics Corporation, Dialog Semiconductor plc is a leading provider of standard and custom integrated circuits (ICs) that power the Internet of Things and Industry 4.0 applications.
Dialog’s proven expertise propels the next generation of today’s devices by providing Battery Management, Bluetooth® low energy, Wi-Fi, Flash memory, and Configurable Mixed-signal ICs, improving power efficiency, reducing charge times, while increasing performance and productivity on the go.
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