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Broadcom Limited BCM56544XB0IFSBG

IC TELECOM INTERFACE MULTI LAYER
part number has RoHS
Manufacturer # :BCM56544XB0IFSBG
Manufacturer :Broadcom Limited
Dasenic # :BCM56544XB0IFSBG-DS
Customer # :
Description : IC TELECOM INTERFACE MULTI LAYER -
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 2522
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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BCM56544XB0IFSBG information

  • Broadcom Limited BCM56544XB0IFSBG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Telecom
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Current - Supply:-
  • Interface:-
  • Supplier Device Package:-
  • Number of Circuits:-
  • Power ( Watts):-
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BCM56544XB0IFSBG provided by Broadcom Limited
Broadcom Inc., a Delaware corporation headquartered in San Jose, California, is a global infrastructure technology leader built on 50 years of innovation, collaboration and engineering excellence. With roots based in the rich technical heritage of AT&T/Bell Labs, Lucent and Hewlett-Packard/Agilent, Broadcom focuses on technologies that connect our world. Through the combination of industry leaders Broadcom, LSI, Broadcom Corporation, Brocade, CA Technologies and Symantec, the company has the size, scope and engineering talent to lead the industry into the future. Broadcom is focused on technology leadership and category-leading semiconductor and infrastructure software solutions. The company is a global leader in numerous product segments serving the world’s most successful companies. Broadcom combines global scale, engineering depth, broad product portfolio diversity, superior execution and operational focus to deliver category-leading semiconductor and infrastructure software solutions so its customers can build and grow successful businesses in a constantly changing environment.
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