Bourns TIC216M-S

Name: TIC216M-S
Brand: Bourns
SKU: TIC216M-S-DS
Availability: InStock
Rating: 4.8 (42 reviews)

in_stock: 81

MOQ: 1

0 Price Tiers

Manufacturer_part :TIC216M-S
Manufacturer :Bourns
Dasenic_Part :TIC216M-S-DS
Datasheet : TIC216M-S Datasheet PDF
Description : TRIAC SENS GATE 600V 6A TO220
package :-
unit_price: $0.0000
total: $0.01

Request_Quote

save_cost

Strict_Quality

Fast_delivery

After_sales

Bourns TIC216M-S technical_specifications

Category:Discrete Semiconductor Devices/Thyristors - TRIACs

Product Status:Obsolete

Operating Temperature:-40°C ~ 110°C (TC)

Mounting Type:Through Hole

Package / Case:TO-220-3

Supplier Device Package:TO-220

Configuration:Single

Current - Hold ( Ih) ( Max):30 mA

Voltage - Off State:600 V

Current - On State ( It ( R M S)) ( Max):6 A

Voltage - Gate Trigger ( Vgt) ( Max):2.2 V

Current - Gate Trigger ( Igt) ( Max):5 mA

Current - Non Rep. Surge 50, 60 Hz ( Itsm):60A @ 50Hz

Triac Type:Logic - Sensitive Gate

EU RoHS Status:ROHS3 Compliant

MSL Rating:1 (Unlimited, 30°C/85%RH)

US ECCN:EAR99

HTS US:8541.30.0080

REACH Status:Vendor is not defined

China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

TIC216M-S provided by Bourns

Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products. Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments. Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A. One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.