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Bourns TIC108N-S
- Mfr.Part # :TIC108N-S
- Manufacturer :Bourns
- Dasenic # :TIC108N-S-DS
- Datasheet : TIC108N-S Datasheet
- Description : SCR 800V 5A TO220
- Package :-
- Quantity :Unit Price : $ 0Total : $ 0.00
- Delivery Time :Ship Within 48 Hours
- Shipping Origin :Shenzhen or Hong Kong Warehouse
- Delivery :
- Payment :
In Stock: 34
( MOQ : 1 PCS )Pricing (USD) :
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Bourns TIC108N-S technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Thyristors - SCRs
Product Status:Obsolete
Operating Temperature:-40°C ~ 110°C
Mounting Type:Through Hole
Package / Case:TO-220-3
Supplier Device Package:TO-220
Current - Hold ( Ih) ( Max):10 mA
Voltage - Off State:800 V
Current - On State ( It ( A V)) ( Max):3.2 A
Current - On State ( It ( R M S)) ( Max):5 A
Voltage - Gate Trigger ( Vgt) ( Max):1 V
Current - Gate Trigger ( Igt) ( Max):1 mA
Current - Non Rep. Surge 50, 60 Hz ( Itsm):20A @ 50Hz
Voltage - On State ( Vtm) ( Max):1.7 V
Current - Off State ( Max):1 mA
S C R Type:Standard Recovery
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
US ECCN:EAR99
HTS US:8541.30.0080
REACH Status:Vendor is not defined
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TIC108N-S provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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