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Bourns PWR221T-30-R330F
Manufacturer # :PWR221T-30-R330F
Manufacturer :Bourns
Dasenic # :PWR221T-30-R330F-DS
Datasheet : PWR221T-30-R330F Datasheet
Customer # :
Description : RES 0.33 OHM 1% 30W TO220-2
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1615
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.523
Total :$ 8.52
Delivery :
Payment :
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PWR221T-30-R330F information
Bourns PWR221T-30-R330F technical specifications, attributes, parameters.
- Category:Resistors/Through Hole Resistors
- Product Status:Active
- Tolerance:±1%
- Temperature Coefficient:±100ppm/°C
- Operating Temperature:-50°C ~ 150°C
- Features:Automotive AEC-Q200, Current Sense, Pulse Withstanding
- Failure Rate:-
- Package / Case:TO-220-2 Full Pack
- Size / Dimension:0.410" L x 0.125" W (10.41mm x 3.18mm)
- Height - Seated ( Max):0.760" (19.30mm)
- Supplier Device Package:TO-220-2
- Power ( Watts):30W
- Number of Terminations:2
- Resistance:330 mOhms
- Composition:Thick Film
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
PWR221T-30-R330F provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.