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Bourns CD214B-S3J
Manufacturer # :CD214B-S3J
Manufacturer :Bourns
Dasenic # :CD214B-S3J-DS
Datasheet : CD214B-S3J Datasheet
Customer # :
Description : DIO RECT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 16278
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1908
Total :$ 0.19
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Bourns CD214B-S3J technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:2-SMD, No Lead
- Supplier Device Package:2-SMD
- Speed:Standard Recovery >500ns, > 200mA (Io)
- Diode Type:Standard
- Current - Average Rectified ( Io):3A
- Voltage - Forward ( Vf) ( Max) @ If:1 V @ 3 A
- Current - Reverse Leakage @ Vr:5 µA @ 600 V
- Capacitance @ Vr, F:23pF @ 4V, 1MHz
- Voltage - D C Reverse ( Vr) ( Max):600 V
- Reverse Recovery Time (trr):-
- Operating Temperature - Junction:-65°C ~ 175°C
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.10.0080
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CD214B-S3J provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.
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