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Bourns 70F157AP-RC
- Mfr.Part # :70F157AP-RC
- Manufacturer :Bourns
- Dasenic # :70F157AP-RC-DS
- Datasheet : 70F157AP-RC Datasheet
- Description : FIXED IND 9.4NH 2.828A 250MOHM
- Package :-
- Quantity :Unit Price : $ 0Total : $ 0.00
- Delivery Time :Ship Within 48 Hours
- Shipping Origin :Shenzhen or Hong Kong Warehouse
- Delivery :
- Payment :
In Stock: 72
( MOQ : 1 PCS )Pricing (USD) :
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Bourns 70F157AP-RC technical specifications, attributes, parameters.
Category:Inductors, Coils, Chokes/Fixed Inductors
Product Status:Obsolete
Tolerance:±20%
Operating Temperature:-55°C ~ 125°C
Features:-
Ratings:-
Mounting Type:Through Hole
Package / Case:Axial
Size / Dimension:0.140" Dia x 0.310" L (3.56mm x 7.87mm)
Height - Seated ( Max):-
Type:Wirewound
Frequency - Self Resonant:490MHz
Current Rating ( Amps):2.828 A
Shielding:Unshielded
Supplier Device Package:-
Q @ Freq:52 @ 25MHz
Inductance:9.4 nH
Material - Core:Phenolic
D C Resistance ( D C R):250mOhm Max
Current - Saturation ( Isat):-
Inductance Frequency - Test:25 MHz
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
70F157AP-RC provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.
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