Bourns 4816P-2-331LF

Name: 4816P-2-331LF
Brand: Bourns
SKU: 4816P-2-331LF-DS
Price: 0.6390 USD
Availability: InStock
Rating: 4.8 (42 reviews)

in_stock: 5757

MOQ: 1

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Manufacturer_part :4816P-2-331LF
Manufacturer :Bourns
Dasenic_Part :4816P-2-331LF-DS
Datasheet : 4816P-2-331LF Datasheet PDF
Description : RES ARRAY 15 RES 330 OHM 16SOIC
package :-
unit_price: $0.6390
total: $0.64

Quantity	unit_price	You Save
1-1	$0.6390	-
2-2000	$0.5805	9.2% save
2001-4000	$0.5589	12.5% save
4001-6000	$0.5454	14.6% save
6001-8000	$0.5373	15.9% save

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Bourns 4816P-2-331LF technical_specifications

Category:Resistors/Resistor Networks & Arrays

Product Status:Active

Tolerance:±2%

Temperature Coefficient:±100ppm/°C

Operating Temperature:-55°C ~ 125°C

Mounting Type:Surface Mount

Package / Case:16-SOIC (0.220", 5.59mm Width)

Size / Dimension:0.440" L x 0.220" W (11.18mm x 5.59mm)

Height - Seated ( Max):0.094" (2.40mm)

Supplier Device Package:16-SOM

Circuit Type:Bussed

Number of Pins:16

Resistance ( Ohms):330

Number of Resistors:15

Resistor Matching Ratio:-

Resistor- Ratio- Drift:-

Power Per Element:80mW

Applications:Automotive AEC-Q200

EU RoHS Status:RoHS Compliant

REACH Status:REACH is not affected

US ECCN:EAR99

China RoHS Status:Green Symbol: Green and environmentally friendly product

4816P-2-331LF provided by Bourns

Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products. Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments. Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A. One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.