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Bourns 4816P-2-331LF
Manufacturer # :4816P-2-331LF
Manufacturer :Bourns
Dasenic # :4816P-2-331LF-DS
Datasheet : 4816P-2-331LF Datasheet
Customer # :
Description : RES ARRAY 15 RES 330 OHM 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6108
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.639
Total :$ 0.64
Delivery :
Payment :
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4816P-2-331LF information
Bourns 4816P-2-331LF technical specifications, attributes, parameters.
- Category:Resistors/Resistor Networks & Arrays
- Product Status:Active
- Tolerance:±2%
- Temperature Coefficient:±100ppm/°C
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.220", 5.59mm Width)
- Size / Dimension:0.440" L x 0.220" W (11.18mm x 5.59mm)
- Height - Seated ( Max):0.094" (2.40mm)
- Supplier Device Package:16-SOM
- Circuit Type:Bussed
- Number of Pins:16
- Resistance ( Ohms):330
- Number of Resistors:15
- Resistor Matching Ratio:-
- Resistor- Ratio- Drift:-
- Power Per Element:80mW
- Applications:Automotive AEC-Q200
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
4816P-2-331LF provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.