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Bourns 4609M-901-101LF
Manufacturer # :4609M-901-101LF
Manufacturer :Bourns
Dasenic # :4609M-901-101LF-DS
Datasheet : 4609M-901-101LF Datasheet
Customer # :
Description : CAP ARRAY 100PF 50V NP0 9SIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 50
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.3935
Total :$ 4.39
Delivery :
Payment :
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4609M-901-101LF information
Bourns 4609M-901-101LF technical specifications, attributes, parameters.
- Category:Capacitors/Capacitor Networks, Arrays
- Product Status:Obsolete
- Capacitance:100pF
- Tolerance:±10%
- Voltage - Rated:50 V
- Temperature Coefficient:C0G, NP0
- Ratings:-
- Mounting Type:Through Hole
- Package / Case:9-SIP
- Size / Dimension:0.902" L x 0.150" W (22.91mm x 3.81mm)
- Height - Seated ( Max):0.200" (5.08mm)
- Dielectric Material:-
- Supplier Device Package:-
- Circuit Type:Bussed
- Number of Capacitors:8
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
4609M-901-101LF provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.