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Bourns 4608X-101-223LF
Manufacturer # :4608X-101-223LF
Manufacturer :Bourns
Dasenic # :4608X-101-223LF-DS
Datasheet : 4608X-101-223LF Datasheet
Customer # :
Description : RES ARRAY 7 RES 22K OHM 8SIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 12000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1463
Total :$ 0.15
Delivery :
Payment :
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4608X-101-223LF information
Bourns 4608X-101-223LF technical specifications, attributes, parameters.
- Category:Resistors/Resistor Networks & Arrays
- Product Status:Active
- Tolerance:±2%
- Temperature Coefficient:±100ppm/°C
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Through Hole
- Package / Case:8-SIP
- Size / Dimension:0.798" L x 0.098" W (20.27mm x 2.49mm)
- Height - Seated ( Max):0.200" (5.08mm)
- Supplier Device Package:8-SIP
- Circuit Type:Bussed
- Number of Pins:8
- Resistance ( Ohms):22k
- Number of Resistors:7
- Resistor Matching Ratio:-
- Resistor- Ratio- Drift:-
- Power Per Element:200mW
- Applications:-
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
4608X-101-223LF provided by Bourns
Bourns, Inc., is a leading manufacturer and supplier of position and speed sensors, circuit protection solutions, magnetic components, microelectronic modules, panel controls and resistive products.
Bourns serves a broad range of markets, including automotive, industrial, consumer, communications, non-critical life support medical (low/medium risk), audio and various other market segments.
Bourns is a worldwide company with sales and distributor locations in every hemisphere. Manufacturing and Research & Development facilities are strategically positioned in key locations. Worldwide headquarters are located in California, U.S.A.
One of Bourns' key strengths as an industry leader lies in our ability to utilize core technologies to provide products and solutions for our customers' applications. Integrating technologies that capture functionality, add value, and reduce overall cost offer quantifiable results of these efforts.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.