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Assmann WSW Components GmbH ADIP08-G-LC
Manufacturer # :ADIP08-G-LC
Manufacturer :Assmann WSW Components GmbH
Dasenic # :ADIP08-G-LC-DS
Datasheet : ADIP08-G-LC Datasheet
Customer # :
Description : CONN DIP HDR IDC 8POS VERT
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In Stock: 2779
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.3946
Total :$ 1.39
Delivery :
Payment :
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ADIP08-G-LC information
Assmann WSW Components GmbH ADIP08-G-LC technical specifications, attributes, parameters.
- Category:Connectors & Interconnects/Rectangular Connectors - Board In, Direct Wire to Board
- Product Status:Obsolete
- Color:Black
- Features:Feed Through
- Mounting Type:Through Hole
- Connector Type:Ribbon Cable, DIP Header
- Number of Positions:8
- Number of Rows:2
- Contact Finish:Gold
- Contact Finish Thickness:Flash
- Wire Gauge:-
- Cable Termination:IDC
- Row Spacing:0.300" (7.62mm)
- Cable Pitch:0.050" (1.27mm)
- Board- Side Pitch:0.100" (2.54mm)
ADIP08-G-LC provided by Assmann WSW Components GmbH
ASSMANN WSW as a part of BCS Group GmbH is well known as a worldwide system supplier for standard- and customer tailored connectors, cable assemblies, heat sinks and assembly services.
The headquarter of the ASSMANN WSW component group is located in Lüdenscheid, Germany. Part of the headquarter is a high bay warehouse, which keeps a high stock level for standard components based on a highly automated logistic system, which has been optimised ongoing throughout the last centuries and which is a key argument for on time delivery performance to the customers.
The common use of the centralized resources in controlling and IT do offer a major synergy effect to the ASSMANN group and the ASSMANN WSW group. ASSMANN WSW components GmbH is targeting a substantial growth of its position on the market. A 100% owned production location in Slovakia, a direct sales network with a clear focus on design-in and a very capable distribution network are the base for a superior growth within all product segments.
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