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Analog Devices Inc./Maxim Integrated DS1230W-100+
- Mfr.Part # :DS1230W-100+
- Manufacturer :Analog Devices Inc./Maxim Integrated
- Dasenic # :DS1230W-100+-DS
- Datasheet : DS1230W-100+ Datasheet
- Description : IC NVSRAM 256KBIT PAR 28EDIP
- Package :-
- Quantity :Unit Price : $ 28.872Total : $ 28.87
- Delivery Time :Ship Within 48 Hours
- Shipping Origin :Shenzhen or Hong Kong Warehouse
- Delivery :
- Payment :
In Stock: 1605
( MOQ : 1 PCS )Pricing (USD) :
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Analog Devices Inc./Maxim Integrated DS1230W-100+ technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Memory Integrated Circuit
Product Status:Active
Operating Temperature:0°C ~ 70°C (TA)
Mounting Type:Through Hole
Package / Case:28-DIP Module (0.600", 15.24mm)
Technology:NVSRAM (Non-Volatile SRAM)
Supplier Device Package:28-EDIP
Memory Size:256Kb (32K x 8)
Memory Type:Non-Volatile
Voltage - Supply:3V ~ 3.6V
Clock Frequency:-
Access Time:100 ns
Memory Format:NVSRAM
Memory Interface:Parallel
Write Cycle Time - Word, Page:100ns
EU RoHS Status:ROHS3 Compliant
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH Unaffected
US ECCN:EAR99
HTS US:8542.32.0041
China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1230W-100+ provided by Analog Devices Inc./Maxim Integrated
Founded in 1983,Maxim Integrated, an engineer’s engineering company, exists to solve the designer’s toughest problems in order to empower design innovation. Maxim's broad portfolio of high-performance semiconductors, combined with world-class tools and support, delivers essential analog solutions including efficient power, precision measurement, reliable connectivity and robust protection along with intelligent processing. Designers in application areas such as automotive, communications, consumer, data center, healthcare, industrial and IoT trust Maxim to help them quickly develop smaller, smarter and more secure designs. In August 2021,Analog Devices, Inc. (NASDAQ: ADI)completed acquisition of Maxim Integrated Products, Inc. (NASDAQ: MXIM).
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