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Amphenol Communications Solutions (ACS) DILB20P-223TLF
CONN IC DIP SOCKET 20POS TIN
Manufacturer # :DILB20P-223TLF
Manufacturer :Amphenol Communications Solutions (ACS)
Dasenic # :DILB20P-223TLF-DS
Datasheet :
DILB20P-223TLF Datasheet
DILB20P-223TLF DatasheetCustomer # :
Description : CONN IC DIP SOCKET 20POS TIN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0855 | $ 0.09 |
In Stock: 29350
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0855
Total :$ 0.09
Delivery :
Payment :
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DILB20P-223TLF information
Amphenol Communications Solutions (ACS) DILB20P-223TLF technical specifications, attributes, parameters.
- Category:Connectors & Interconnects/Sockets for ICs, Transistors
- Product Status:Active
- Operating Temperature:-55°C ~ 105°C
- Features:Open Frame
- Mounting Type:Through Hole
- Termination:Solder
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Housing Material:Polyamide (PA), Nylon
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Tin
- Contact Finish Thickness - Mating:100.0µin (2.54µm)
- Contact Finish - Post:Tin
- Number of Positions or Pins ( Grid):20 (2 x 10)
- Pitch - Post:0.100" (2.54mm)
- Contact Material - Mating:Copper Alloy
- Contact Finish Thickness - Post:100.0µin (2.54µm)
- Contact Material - Post:Copper Alloy
DILB20P-223TLF provided by Amphenol Communications Solutions (ACS)
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets.
ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive.
ACS is comprised of several key businesses including:Amphenol Aorora,Amphenol Transceivers,Commercial Industrial,Commercial IO,FCI Basics,High Speed Backplane,High Speed IO,Mezzanine Products,etc.
Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes.
Amphenol Communications Solutions (ACS) Related product recommendations
We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.