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Amphenol Communications Solutions (ACS) DA3V3PA00LF

CONN D-SUB HOUSING PLUG 3POS
part number has RoHS
Manufacturer # :DA3V3PA00LF
Dasenic # :DA3V3PA00LF-DS
Customer # :
Description : CONN D-SUB HOUSING PLUG 3POS
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
25+$ 1.1610$ 29.03
250+$ 0.9360$ 234
500+$ 0.8982$ 449.1
1000+$ 0.8595$ 859.5
2500+$ 0.8244$ 2061
In Stock: 1837
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.161
Total :$ 1.16
Delivery :
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Payment :
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DA3V3PA00LF information

  • Amphenol Communications Solutions (ACS) DA3V3PA00LF technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/D-Sub, D-Shaped Connectors - Housings
  • Product Status:Active
  • Features:Grounding Indents
  • Mounting Type:Free Hanging (In-Line)
  • Ingress Protection:-
  • Connector Type:Plug for Female and Male Contacts
  • Number of Positions:3 (Power)
  • Number of Rows:1
  • Connector Style:D-Sub, Combo
  • Contact Type:Power
  • Primary Material:-
  • Shell Material, Finish:Steel, Tin Plated
  • Flange Feature:Housing/Shell (Unthreaded)
  • Shell Size, Connector Layout:2 (DA, A) - 3W3
  • Shell Finish Thickness:-
DA3V3PA00LF provided by Amphenol Communications Solutions (ACS)
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive. ACS is comprised of several key businesses including:Amphenol Aorora,Amphenol Transceivers,Commercial Industrial,Commercial IO,FCI Basics,High Speed Backplane,High Speed IO,Mezzanine Products,etc. Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes.
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