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Amphenol Communications Solutions (ACS) 91901-31425LF

CONN HDR 25POS SMD GOLD
part number has RoHS
Manufacturer # :91901-31425LF
Dasenic # :91901-31425LF-DS
Customer # :
Description : CONN HDR 25POS SMD GOLD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 2.6160$ 26.16
500+$ 2.1800$ 1090
5000+$ 2.1800$ 10900
In Stock: 1125
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.616
Total :$ 2.62
Delivery :
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91901-31425LF information

  • Amphenol Communications Solutions (ACS) 91901-31425LF technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
  • Product Status:Active
  • Features:Solder Retention
  • Mounting Type:Surface Mount
  • Connector Type:Header, Center Strip Contacts
  • Number of Positions:25
  • Number of Rows:2
  • Contact Finish:Gold or Gold, GXT™
  • Contact Finish Thickness:15.0µin (0.38µm)
  • Pitch:0.039" (1.00mm)
  • Height Above Board:0.107" (2.72mm)
  • Mated Stacking Heights:6mm
91901-31425LF provided by Amphenol Communications Solutions (ACS)
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive. ACS is comprised of several key businesses including:Amphenol Aorora,Amphenol Transceivers,Commercial Industrial,Commercial IO,FCI Basics,High Speed Backplane,High Speed IO,Mezzanine Products,etc. Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes.
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