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Amphenol Communications Solutions (ACS) 89006-126LF

CONN HEADER 30POS PCB
part number has RoHS
Manufacturer # :89006-126LF
Dasenic # :89006-126LF-DS
Customer # :
Description : CONN HEADER 30POS PCB
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 2.6935$ 26.94
384+$ 2.2446$ 861.93
In Stock: 36941
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.6935
Total :$ 2.69
Delivery :
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89006-126LF information

  • Amphenol Communications Solutions (ACS) 89006-126LF technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/Backplane Connectors - Specialized
  • Product Status:Active
  • Color:Natural, White
  • Features:-
  • Mounting Type:Through Hole
  • Termination:Press-Fit
  • Connector Type:Header, Male Pins
  • Number of Positions:30
  • Number of Rows:5
  • Contact Finish:Gold
  • Contact Finish Thickness:30.0µin (0.76µm)
  • Pitch:0.079" (2.00mm)
  • Connector Style:-
  • Number of Columns:-
  • Connector Usage:-
  • Contact Layout, Typical:-
  • Number of Positions Loaded:All
89006-126LF provided by Amphenol Communications Solutions (ACS)
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive. ACS is comprised of several key businesses including:Amphenol Aorora,Amphenol Transceivers,Commercial Industrial,Commercial IO,FCI Basics,High Speed Backplane,High Speed IO,Mezzanine Products,etc. Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes.
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