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Amphenol Communications Solutions (ACS) 76602-101LF

CONN HEADER
part number has RoHS
Manufacturer # :76602-101LF
Dasenic # :76602-101LF-DS
Customer # :
Description : CONN HEADER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 751
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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76602-101LF information

  • Amphenol Communications Solutions (ACS) 76602-101LF technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/Terminals - PC Pin, Single Post Connectors
  • Product Status:Active
  • Mounting Type:Through Hole
  • Termination:Solder
  • Contact Finish:Gold
  • Contact Finish Thickness:30.0µin (0.76µm)
  • Length - Overall:0.390" (9.91mm)
  • Contact Material:Phosphor Bronze
  • Insulation:Non-Insulated
  • Board Thickness:0.062" ~ 0.125" (1.57mm ~ 3.18mm)
  • Terminal Type:Single Post
  • Mounting Hole Diameter:0.034" ~ 0.036" (0.86mm ~ 0.91mm)
  • Flange Diameter:-
  • Terminal Style:Pin Retention
  • Length - Above Flange:-
  • Length - Below Flange:-
  • Pin Size - Above Flange:0.025" (0.64mm) Square
  • Pin Size - Below Flange:0.025" (0.64mm) Dia
76602-101LF provided by Amphenol Communications Solutions (ACS)
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive. ACS is comprised of several key businesses including:Amphenol Aorora,Amphenol Transceivers,Commercial Industrial,Commercial IO,FCI Basics,High Speed Backplane,High Speed IO,Mezzanine Products,etc. Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes.
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