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Amphenol Communications Solutions (ACS) 10118529-003RLF

ANTENNA 1.8H TI CU G/F P
part number has RoHS
Manufacturer # :10118529-003RLF
Dasenic # :10118529-003RLF-DS
Customer # :
Description : ANTENNA 1.8H TI CU G/F P
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.2152$ 2.15
30000+$ 0.1076$ 3228
In Stock: 2016
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2152
Total :$ 0.22
Delivery :
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Payment :
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10118529-003RLF information

  • Amphenol Communications Solutions (ACS) 10118529-003RLF technical specifications, attributes, parameters.
  • Category:RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets
  • Product Status:Obsolete
  • Material:Beryllium Copper Alloy
  • Operating Temperature:-
  • Type:Shield Finger, Pre-Loaded
  • Shape:-
  • Height:0.071" (1.80mm)
  • Width:0.024" (0.60mm)
  • Length:0.134" (3.40mm)
  • Plating:Gold
  • Attachment Method:Solder
  • Plating - Thickness:Flash
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
10118529-003RLF provided by Amphenol Communications Solutions (ACS)
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive. ACS is comprised of several key businesses including:Amphenol Aorora,Amphenol Transceivers,Commercial Industrial,Commercial IO,FCI Basics,High Speed Backplane,High Speed IO,Mezzanine Products,etc. Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes.
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