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Amphenol Communications Solutions (ACS) 10018783-10201MLF

CONN PCI EXP FMALE 64POS 0.039
part number has RoHS
Manufacturer # :10018783-10201MLF
Dasenic # :10018783-10201MLF-DS
Customer # :
Description : CONN PCI EXP FMALE 64POS 0.039
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 4558
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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10018783-10201MLF information

  • Amphenol Communications Solutions (ACS) 10018783-10201MLF technical specifications, attributes, parameters.
  • Category:Connectors & Interconnects/Card Edge Connectors - Edgeboard Connectors
  • Product Status:Active
  • Color:Black
  • Operating Temperature:-55°C ~ 85°C
  • Features:Board Guide, Locking Ramp
  • Mounting Type:Through Hole
  • Termination:Solder, Staggered
  • Number of Positions:64
  • Number of Rows:2
  • Contact Finish:Gold
  • Contact Finish Thickness:Flash
  • Pitch:0.039" (1.00mm)
  • Contact Material:Copper Alloy
  • Gender:Female
  • Contact Type:Cantilever
  • Card Thickness:0.062" (1.57mm)
  • Read Out:Dual
  • Card Type:PCI Express™
  • Flange Feature:-
  • Number of Positions/ Bay/ Row:11; 21
10018783-10201MLF provided by Amphenol Communications Solutions (ACS)
Amphenol Communications Solutions (ACS), a division of Amphenol Corporation, is a world leader in interconnect solutions for Communications, Mobile Consumer Products, RF, Optical, Broadband and Commercial electronics markets. ACS has an expansive global presence in research and development, manufacturing, and sales. We design and manufacture a wide range of innovative connectors as well as cable assemblies for diverse applications including server, storage, data center, mobile, RF, networking, industrial, business equipment and automotive. ACS is comprised of several key businesses including:Amphenol Aorora,Amphenol Transceivers,Commercial Industrial,Commercial IO,FCI Basics,High Speed Backplane,High Speed IO,Mezzanine Products,etc. Our R&D centers worldwide have registered thousands of patents and licensing agreements, developing some of the world’s first innovations in connectors such as Shield-less High-Speed Connectors, Ball-Grid-Array Attachments, economical Stamped High-Power Contacts and cost effective yet reliable plating processes.
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