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AMD / Xilinx XC17S30APD8C
Manufacturer # :XC17S30APD8C
Manufacturer :AMD / Xilinx
Dasenic # :XC17S30APD8C-DS
Datasheet : XC17S30APD8C Datasheet
Customer # :
Description : IC PROM SER 30000 C-TEMP 8-DIP
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In Stock: 37490
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.009
Total :$ 0.01
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XC17S30APD8C information
AMD / Xilinx XC17S30APD8C technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory - Configuration Proms for FPGAs
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Supplier Device Package:8-PDIP
- Memory Size:300kb
- Voltage - Supply:3V ~ 3.6V
- Programmable Type:OTP
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
XC17S30APD8C provided by AMD / Xilinx
Founded in 1984 and headquartered in San Francisco, California, Xilinx, Inc. is the world's leading provider of complete programmable logic solutions.
Xilinx designs and develops programmable logic products, including integrated circuits (ICs), software design tools, predefined system functions delivered as intellectual property (IP) cores, design services, customer training, field engineering and technical support.
Xilinx is renowned as the inventor of FPGA, programmable SoC, and ACAP. With 3,500 patents and 60 industry firsts, Xilinx boasts an impressive history of achievements.
In February 2022, Advanced Micro Devices Inc. completed the acquisition of Xilinx Inc. in a record chip industry deal valued at approximately $50 billion, granting it an extra edge in the crucial data center market.
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