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Texas Instruments THS10082CDAG4
Manufacturer # :THS10082CDAG4
Manufacturer :Texas Instruments
Dasenic # :THS10082CDAG4-DS
Datasheet : THS10082CDAG4 Datasheet
Customer # :
Description : IC ADC 10BIT PIPELINED 32TSSOP
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In Stock: 6855
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 11.0331
Total :$ 11.03
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Texas Instruments THS10082CDAG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Analog to Digital Converters (ADC)
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Features:Simultaneous Sampling
- Mounting Type:Surface Mount
- Package / Case:32-TSSOP (0.240", 6.10mm Width)
- Input Type:Differential, Single Ended
- Supplier Device Package:32-TSSOP
- Configuration:S/H-MUX-ADC
- Sampling Rate ( Per Second):8M
- Data Interface:Parallel
- Number of Bits:10
- Voltage - Supply, Analog:5V
- Voltage - Supply, Digital:3V ~ 5.25V
- Number of Inputs:1, 2
- Ratio - S/ H: A D C:2:1
- Number of A/ D Converters:1
- Architecture:Pipelined
- Reference Type:External, Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
THS10082CDAG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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