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Texas Instruments SN74AVC16269DGGR
Manufacturer # :SN74AVC16269DGGR
Manufacturer :Texas Instruments
Dasenic # :SN74AVC16269DGGR-DS
Datasheet : SN74AVC16269DGGR Datasheet
Customer # :
Description : IC RGSTRD BUS EXCHANGER 56TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 12000
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.124
Total :$ 2.12
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Texas Instruments SN74AVC16269DGGR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Universal Bus Functions
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package:56-TSSOP
- Number of Circuits:12 ~ 24-Bit
- Voltage - Supply:1.4V ~ 3.6V
- Logic Type:Registered Bus Exchanger
- Current - Output High, Low:12mA, 12mA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74AVC16269DGGR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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