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Texas Instruments XMSP432P401RIPZR
Manufacturer # :XMSP432P401RIPZR
Manufacturer :Texas Instruments
Dasenic # :XMSP432P401RIPZR-DS
Datasheet : XMSP432P401RIPZR Datasheet
Customer # :
Description : IC MCU 32BIT 256KB FLASH 100LQFP
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In Stock: 8220
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 3.8303
Total :$ 3.83
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XMSP432P401RIPZR information
Texas Instruments XMSP432P401RIPZR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Microcontroller, Microprocessor, FPGA Modules
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:100-LQFP
- Supplier Device Package:100-LQFP (14x14)
- Peripherals:DMA, POR, PWM, WDT
- Number of I/ O:84
- Speed:48MHz
- E E P R O M Size:-
- Core Processor:ARM® Cortex®-M4F
- R A M Size:64K x 8
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- Connectivity:I²C, IrDA, SPI, UART/USART
- Program Memory Size:256KB (256K x 8)
- Voltage - Supply ( Vcc/ Vdd):1.62V ~ 3.7V
- Data Converters:A/D 26x14b
- Oscillator Type:Internal
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:5A992C
- HTS US:8542.31.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
XMSP432P401RIPZR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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