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Texas Instruments ULN2004ADG4
Manufacturer # :ULN2004ADG4
Manufacturer :Texas Instruments
Dasenic # :ULN2004ADG4-DS
Datasheet : ULN2004ADG4 Datasheet
Customer # :
Description : 50-V, 7-ch darlington transistor array with 15-V input capability, -20C to 70C
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In Stock: 2000
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3863
Total :$ 0.39
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Texas Instruments ULN2004ADG4 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Power Distribution Switches, Load Drivers
- Interface:Parallel
- Supplier Device Package:16-SOIC
- Series:ULx200xA
- Operating Temperature:-40°C ~ 70°C (TA)
- Ratio- Input: Output:1:1
- Input Type:Inverting
- Output Type:NPN
- Voltage- Supply( Vcc/ Vdd):Not Required
- Numberof Outputs:7
- Output Configuration:Low Side
- Voltage- Load:50V (Max)
- Current- Output( Max):500mA
- Switch Type:Relay, Solenoid Driver
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ULN2004ADG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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