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Texas Instruments UCC561DPTR

IC LV DIFF SCSI REG 16-SOIC
part number has RoHS
Manufacturer # :UCC561DPTR
Manufacturer :Texas Instruments
Dasenic # :UCC561DPTR-DS
Customer # :
Description : IC LV DIFF SCSI REG 16-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.3860$ 1.39
25+$ 1.3590$ 33.98
100+$ 1.3050$ 130.5
500+$ 1.2510$ 625.5
1000+$ 1.1790$ 1179
In Stock: 21000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.386
Total :$ 1.39
Delivery :
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UCC561DPTR information

  • Texas Instruments UCC561DPTR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Signal Terminators
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.154", 3.90mm Width)
  • Type:SCSI, LVD
  • Supplier Device Package:16-SOIC
  • Voltage - Supply:2.7V ~ 5.25V
  • Number of Terminations:27
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
UCC561DPTR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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