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Texas Instruments UCC3957M-3

IC BATT PROT LI-ION 3-4CL 16SSOP
part number has RoHS
Manufacturer # :UCC3957M-3
Manufacturer :Texas Instruments
Dasenic # :UCC3957M-3-DS
Customer # :
Description : IC BATT PROT LI-ION 3-4CL 16SSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 7.5000$ 7.5
25+$ 7.3600$ 184
100+$ 7.0600$ 706
500+$ 6.7600$ 3380
1000+$ 6.3800$ 6380
In Stock: 1501
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.5
Total :$ 7.50
Delivery :
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UCC3957M-3 information

  • Texas Instruments UCC3957M-3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/PMIC - Battery Management
  • Product Status:Obsolete
  • Operating Temperature:-20°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SSOP (0.154", 3.90mm Width)
  • Battery Chemistry:Lithium Ion
  • Number of Cells:3 ~ 4
  • Interface:-
  • Supplier Device Package:16-SSOP
  • Fault Protection:Over Current, Over/Under Voltage
  • Function:Battery Protection
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
UCC3957M-3 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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