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Texas Instruments TPS650231RSBT
IC BAT PWR MGMT LI-ION 1C 40WQFN
Manufacturer # :TPS650231RSBT
Manufacturer :Texas Instruments
Dasenic # :TPS650231RSBT-DS
Datasheet :
TPS650231RSBT Datasheet
TPS650231RSBT DatasheetCustomer # :
Description : IC BAT PWR MGMT LI-ION 1C 40WQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 4.1734 | $ 41.73 |
| 250+ | $ 3.4778 | $ 869.45 |
| 500+ | $ 3.3743 | $ 1687.15 |
| 750+ | $ 3.4778 | $ 2608.35 |
| 1250+ | $ 3.2650 | $ 4081.25 |
In Stock: 2000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.1734
Total :$ 4.17
Delivery :
Payment :
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TPS650231RSBT information
Texas Instruments TPS650231RSBT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Battery Management
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:40-WFQFN Exposed Pad
- Battery Chemistry:Lithium Ion/Polymer
- Number of Cells:1
- Interface:I²C
- Supplier Device Package:40-WQFN (5x5)
- Fault Protection:Over Temperature
- Function:Power Management
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPS650231RSBT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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