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Texas Instruments TPD4E6B06DPWR
Manufacturer # :TPD4E6B06DPWR
Manufacturer :Texas Instruments
Dasenic # :TPD4E6B06DPWR-DS
Datasheet : TPD4E6B06DPWR Datasheet
Customer # :
Description : TVS DIODE 5.5VWM 13VC 4X2SON 4-XFDFN Exposed Pad
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9000
MOQ :1 PCS
Packaging :4-XFDFN Exposed Pad
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.549
Total :$ 0.55
Delivery :
Payment :
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TPD4E6B06DPWR information
Texas Instruments TPD4E6B06DPWR technical specifications, attributes, parameters.
- Category:Circuit Protection Devices/TVS - Diodes
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:4-XFDFN Exposed Pad
- Type:Zener
- Capacitance @ Frequency:-
- Supplier Device Package:4-X2SON (0.8x0.8)
- Unidirectional Channels:-
- Voltage - Reverse Standoff ( Typ):5.5V (Max)
- Voltage - Breakdown ( Min):6V
- Voltage - Clamping ( Max) @ Ipp:13V (Typ)
- Current - Peak Pulse (10/1000µs):3A (8/20µs)
- Power - Peak Pulse:40W
- Power Line Protection:No
- Bidirectional Channels:4
- Applications:General Purpose
TPD4E6B06DPWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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