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Texas Instruments TPA4411RTJT
Manufacturer # :TPA4411RTJT
Manufacturer :Texas Instruments
Dasenic # :TPA4411RTJT-DS
Datasheet : TPA4411RTJT Datasheet
Customer # :
Description : IC AMP CLASS AB STER 100MW 20QFN
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In Stock: 6306
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.927
Total :$ 0.93
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TPA4411RTJT information
Texas Instruments TPA4411RTJT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Features:Depop, Short-Circuit and Thermal Protection, Shutdown
- Mounting Type:Surface Mount
- Package / Case:20-WFQFN Exposed Pad
- Type:Class AB
- Output Type:Headphones, 2-Channel (Stereo)
- Supplier Device Package:20-QFN (4x4)
- Voltage - Supply:1.8V ~ 4.5V
- Max Output Power x Channels @ Load:100mW x 2 @ 16Ohm
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TPA4411RTJT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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