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Texas Instruments TNETV2505ZGW
Manufacturer # :TNETV2505ZGW
Manufacturer :Texas Instruments
Dasenic # :TNETV2505ZGW-DS
Datasheet : TNETV2505ZGW Datasheet
Customer # :
Description : IC DSP FIXED POINT BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 10
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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TNETV2505ZGW information
Texas Instruments TNETV2505ZGW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:240-LFBGA
- Type:Fixed Point
- Interface:-
- Supplier Device Package:240-BGA MICROSTAR (15x15)
- Clock Rate:-
- Non- Volatile Memory:-
- On- Chip R A M:-
- Voltage - I/ O:-
- Voltage - Core:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- US ECCN:3A991A2
- HTS US:8542.31.0001
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TNETV2505ZGW provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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