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Texas Instruments TMS320DM8165SCYG4

IC DGTL MEDIA PROCESSR 1031FCBGA
part number has RoHS
Manufacturer # :TMS320DM8165SCYG4
Manufacturer :Texas Instruments
Dasenic # :TMS320DM8165SCYG4-DS
Customer # :
Description : IC DGTL MEDIA PROCESSR 1031FCBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
44+$ 232.6000$ 10234.4
In Stock: 1084
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 232.6
Total :$ 232.60
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TMS320DM8165SCYG4 information

  • Texas Instruments TMS320DM8165SCYG4 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Active
  • Operating Temperature:0°C ~ 95°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:1031-BFBGA, FCBGA
  • Type:Digital Media System-on-Chip (DMSoC)
  • Interface:EBI/EMI, Ethernet, I²C, McASP, McBSP, PCI, Serial ATA, SD/SDIO, SPI, UART, USB
  • Supplier Device Package:1031-FCBGA (25x25)
  • Clock Rate:1.125GHz DSP, 1.35GHz ARM®
  • Non- Volatile Memory:ROM (48kB)
  • On- Chip R A M:1.5MB
  • Voltage - I/ O:1.5V, 1.8V, 3.3V
  • Voltage - Core:1.00V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:4 (72 Hours)
  • REACH Status:REACH Unaffected
  • US ECCN:5A002A1 TI
  • HTS US:8542.31.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
TMS320DM8165SCYG4 provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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