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Texas Instruments TM4C1230E6PMIR
Manufacturer # :TM4C1230E6PMIR
Manufacturer :Texas Instruments
Dasenic # :TM4C1230E6PMIR-DS
Datasheet : TM4C1230E6PMIR Datasheet
Customer # :
Description : 32-bit Arm Cortex-M4F based MCU with 80-MHz, 128-kb Flash, 32-kb RAM, CAN, 64-pin LQFP
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In Stock: 5790
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.407
Total :$ 7.41
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TM4C1230E6PMIR information
Texas Instruments TM4C1230E6PMIR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Package / Case:64-LQFP
- Peripherals:Brown-out Detect/Reset, DMA, POR, WDT
- Speed:80MHz
- Connectivity:CANbus, I²C, IrDA, Microwire, SPI, SSI, UART/USART
- Series:Tiva™ C
- Operating Temperature:-40°C ~ 85°C (TA)
- Core Processor:ARM® Cortex®-M4F
- R A M Size:32K x 8
- Numberof I/ O:49
- Program Memory Type:Flash
- Core Size:32-Bit Single-Core
- E E P R O M Size:2K x 8
- Data Converters:A/D 12x12b
- Oscillator Type:Internal
- Program Memory Size:128KB (128K x 8)
- Voltage- Supply( Vcc/ Vdd):1.08V ~ 3.63V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TM4C1230E6PMIR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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