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Texas Instruments TLVH432IPK
Manufacturer # :TLVH432IPK
Manufacturer :Texas Instruments
Dasenic # :TLVH432IPK-DS
Datasheet : TLVH432IPK Datasheet
Customer # :
Description : IC VREF SHUNT ADJ 1.5% SOT89-3
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In Stock: 14379
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.2764
Total :$ 0.28
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TLVH432IPK information
Texas Instruments TLVH432IPK technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - Voltage Reference
- Product Status:Obsolete
- Tolerance:±1.5%
- Temperature Coefficient:-
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:TO-243AA
- Current - Supply:-
- Voltage - Input:-
- Output Type:Adjustable
- Supplier Device Package:SOT-89-3
- Reference Type:Shunt
- Current - Output:70 mA
- Voltage - Output ( Min/ Fixed):1.24V
- Voltage - Output ( Max):18 V
- Noise - 0.1 Hz to 10 Hz:-
- Noise - 10 Hz to 10k Hz:-
- Current - Cathode:100 µA
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:2 (1 Year,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TLVH432IPK provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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