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Texas Instruments TLV3601DCKT
Manufacturer # :TLV3601DCKT
Manufacturer :Texas Instruments
Dasenic # :TLV3601DCKT-DS
Datasheet : TLV3601DCKT Datasheet
Customer # :
Description : 2.5-ns high-speed rail-to-rail comparator with push-pull outputs
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1527
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.166
Total :$ 5.17
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Texas Instruments TLV3601DCKT technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Comparators Linear
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:5-TSSOP, SC-70-5, SOT-353
- Type:General Purpose
- Output Type:CMOS, Push-Pull, Rail-to-Rail
- Supplier Device Package:SC-70-5
- Number of Elements:1
- Voltage - Supply, Single/ Dual (±):2.4V ~ 5.5V
- Voltage - Input Offset ( Max):5mV @ 5V
- Current - Input Bias ( Max):1µA @ 5V
- Current - Output ( Typ):30mA @ 5V
- Current - Quiescent ( Max):7mA
- C M R R, P S R R ( Typ):80dB CMRR, 80dB PSRR
- Propagation Delay ( Max):3.5ns
- Hysteresis:5mV
- Packaging:Tape & Reel (TR)
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLV3601DCKT provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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