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Texas Instruments TLC320AD77CDBR
Manufacturer # :TLC320AD77CDBR
Manufacturer :Texas Instruments
Dasenic # :TLC320AD77CDBR-DS
Datasheet : TLC320AD77CDBR Datasheet
Customer # :
Description : IC STER AUDIO CODEC 24BIT 28SSOP
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In Stock: 6676
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.009
Total :$ 0.01
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TLC320AD77CDBR information
Texas Instruments TLC320AD77CDBR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - CODECs
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:28-SSOP (0.209", 5.30mm Width)
- Type:Stereo Audio
- Supplier Device Package:28-SSOP
- Resolution ( Bits):24 b
- Data Interface:Serial
- Voltage - Supply, Analog:3V ~ 3.6V
- Voltage - Supply, Digital:3V ~ 3.6V
- Number of A D Cs / D A Cs:1 / 1
- Sigma Delta:Yes
- S/ N Ratio, A D Cs / D A Cs (db) Typ:100 / 100
- Dynamic Range, A D Cs / D A Cs (db) Typ:100 / 100
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TLC320AD77CDBR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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