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Texas Instruments TLC2274MD
Manufacturer # :TLC2274MD
Manufacturer :Texas Instruments
Dasenic # :TLC2274MD-DS
Datasheet : TLC2274MD Datasheet
Customer # :
Description : IC OPAMP GP 4 CIRCUIT 14SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 3405
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.683
Total :$ 1.68
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Texas Instruments TLC2274MD technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-SOIC (0.154", 3.90mm Width)
- Current - Supply:4.8mA (x4 Channels)
- Output Type:Rail-to-Rail
- Supplier Device Package:14-SOIC
- Number of Circuits:4
- Amplifier Type:General Purpose
- -3db Bandwidth:-
- Current - Output / Channel:50 mA
- Slew Rate:3.6V/µs
- Gain Bandwidth Product:2.25 MHz
- Current - Input Bias:1 pA
- Voltage - Input Offset:300 µV
- Voltage - Supply Span ( Min):4.4 V
- Voltage - Supply Span ( Max):16 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TLC2274MD provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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