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Texas Instruments TL051CDR
Manufacturer # :TL051CDR
Manufacturer :Texas Instruments
Dasenic # :TL051CDR-DS
Datasheet : TL051CDR Datasheet
Customer # :
Description : IC OPAMP JFET 1 CIRCUIT 8SOIC
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In Stock: 14244
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0328
Total :$ 0.03
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Texas Instruments TL051CDR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Current - Supply:2.7mA
- Output Type:-
- Supplier Device Package:8-SOIC
- Number of Circuits:1
- Amplifier Type:J-FET
- -3db Bandwidth:-
- Current - Output / Channel:-
- Slew Rate:20V/µs
- Gain Bandwidth Product:3.1 MHz
- Current - Input Bias:30 pA
- Voltage - Input Offset:590 µV
- Voltage - Supply Span ( Min):10 V
- Voltage - Supply Span ( Max):30 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TL051CDR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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