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Texas Instruments THS4011CDGNR
Manufacturer # :THS4011CDGNR
Manufacturer :Texas Instruments
Dasenic # :THS4011CDGNR-DS
Datasheet : THS4011CDGNR Datasheet
Customer # :
Description : IC OPAMP VFB 1 CIRCUIT 8HVSSOP
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In Stock: 7500
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.907
Total :$ 2.91
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Payment :
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THS4011CDGNR information
Texas Instruments THS4011CDGNR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Instrumentation, OP Amps, Buffer Amps
- Product Status:Active
- Operating Temperature:0°C ~ 70°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
- Current - Supply:7.8mA
- Output Type:-
- Supplier Device Package:8-HVSSOP
- Number of Circuits:1
- Amplifier Type:Voltage Feedback
- -3db Bandwidth:290 MHz
- Current - Output / Channel:-
- Slew Rate:310V/µs
- Gain Bandwidth Product:290 MHz
- Current - Input Bias:2 µA
- Voltage - Input Offset:1 mV
- Voltage - Supply Span ( Min):9 V
- Voltage - Supply Span ( Max):32 V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
THS4011CDGNR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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