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Texas Instruments TAS5709APHPR
Manufacturer # :TAS5709APHPR
Manufacturer :Texas Instruments
Dasenic # :TAS5709APHPR-DS
Datasheet : TAS5709APHPR Datasheet
Customer # :
Description : IC AMP CLSS D STER 20.6W 48HTQFP
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In Stock: 26453
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.69
Total :$ 3.69
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Payment :
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TAS5709APHPR information
Texas Instruments TAS5709APHPR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TA)
- Features:Depop, Digital Inputs, I²C, I²S, Mute, Short-Circuit and Thermal Protection, Shutdown, Volume Control
- Mounting Type:Surface Mount
- Package / Case:48-PowerTQFP
- Type:Class D
- Output Type:2-Channel (Stereo)
- Supplier Device Package:48-HTQFP (7x7)
- Voltage - Supply:8V ~ 24V
- Max Output Power x Channels @ Load:20.6W x 2 @ 8Ohm
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.33.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TAS5709APHPR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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