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Texas Instruments SN74SSTV16859DGGR

IC REG BUFFER 13-26BIT 64-TSSOP
part number has RoHS
Manufacturer # :SN74SSTV16859DGGR
Manufacturer :Texas Instruments
Dasenic # :SN74SSTV16859DGGR-DS
Customer # :
Description : IC REG BUFFER 13-26BIT 64-TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.9780$ 3.98
25+$ 3.8970$ 97.43
100+$ 3.7350$ 373.5
500+$ 3.5820$ 1791
1000+$ 3.3840$ 3384
In Stock: 18905
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.978
Total :$ 3.98
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SN74SSTV16859DGGR information

  • Texas Instruments SN74SSTV16859DGGR technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Specialty Logic
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Surface Mount
  • Package / Case:64-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package:64-TSSOP
  • Supply Voltage:2.3V ~ 2.7V
  • Number of Bits:13, 26
  • Logic Type:Registered Buffer with SSTL_2 Compatible I/O for DDR
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74SSTV16859DGGR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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