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Texas Instruments SN74ALVCH16409DGGR
IC UNIV BUS EXCHANGER 56TSSOP
Manufacturer # :SN74ALVCH16409DGGR
Manufacturer :Texas Instruments
Dasenic # :SN74ALVCH16409DGGR-DS
Datasheet :
SN74ALVCH16409DGGR Datasheet
SN74ALVCH16409DGGR DatasheetCustomer # :
Description : IC UNIV BUS EXCHANGER 56TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 1.0440 | $ 1.04 |
| 25+ | $ 1.0260 | $ 25.65 |
| 100+ | $ 0.9810 | $ 98.1 |
| 500+ | $ 0.9360 | $ 468 |
| 1000+ | $ 0.8877 | $ 887.7 |
In Stock: 14400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.044
Total :$ 1.04
Delivery :
Payment :
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SN74ALVCH16409DGGR information
Texas Instruments SN74ALVCH16409DGGR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Universal Bus Functions
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:56-TFSOP (0.240", 6.10mm Width)
- Supplier Device Package:56-TSSOP
- Number of Circuits:9-Bit, 4-Port
- Voltage - Supply:1.65V ~ 3.6V
- Logic Type:Universal Bus Exchanger
- Current - Output High, Low:24mA, 24mA
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SN74ALVCH16409DGGR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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