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Texas Instruments SN74AHCT174PWR
Manufacturer # :SN74AHCT174PWR
Manufacturer :Texas Instruments
Dasenic # :SN74AHCT174PWR-DS
Datasheet : SN74AHCT174PWR Datasheet
Customer # :
Description : IC FF D-TYPE SNGL 6BIT 16TSSOP
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In Stock: 12000
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1212
Total :$ 0.12
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Texas Instruments SN74AHCT174PWR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Flip Flops
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Type:D-Type
- Output Type:Non-Inverted
- Supplier Device Package:16-TSSOP
- Number of Elements:1
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:115 MHz
- Number of Bits per Element:6
- Current - Output High, Low:8mA, 8mA
- Max Propagation Delay @ V, Max C L:8.8ns @ 5V, 50pF
- Current - Quiescent ( Iq):4 µA
- Trigger Type:Positive Edge
- Input Capacitance:2 pF
- Function:Master Reset
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SN74AHCT174PWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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