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Texas Instruments P82B715P
Manufacturer # :P82B715P
Manufacturer :Texas Instruments
Dasenic # :P82B715P-DS
Datasheet : P82B715P Datasheet
Customer # :
Description : IC REDRIVER I2C 1CH 8DIP
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In Stock: 5472
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.592
Total :$ 2.59
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Payment :
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P82B715P information
Texas Instruments P82B715P technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Signal Buffers, Repeaters, Splitters
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Current - Supply:22mA
- Type:Buffer, ReDriver
- Number of Channels:1
- Supplier Device Package:8-PDIP
- Data Rate ( Max):-
- Output:2-Wire Bus
- Voltage - Supply:4.5V ~ 12V
- Input:2-Wire Bus
- Delay Time:-
- Signal Conditioning:-
- Capacitance - Input:3000 pF
- Applications:I²C
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
P82B715P provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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