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Texas Instruments MSP430F2234IDA

16 MHz MCU with 8KB Flash, 512B SRAM, 10-bit ADC, 2 OpAmp, I2C/SPI/UART
part number has RoHS
Manufacturer # :MSP430F2234IDA
Manufacturer :Texas Instruments
Dasenic # :MSP430F2234IDA-DS
Customer # :
Description : 16 MHz MCU with 8KB Flash, 512B SRAM, 10-bit ADC, 2 OpAmp, I2C/SPI/UART
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QuantityUnit PriceTotal
1+$ 9.8400$ 9.84
5+$ 9.1000$ 45.5
In Stock: 2316
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 9.84
Total :$ 9.84
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MSP430F2234IDA information

  • Texas Instruments MSP430F2234IDA technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
  • Product Status:Active
  • Package / Case:38-TSSOP (0.240, 6.10mm Width)
  • Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
  • Speed:16MHz
  • Connectivity:I²C, IrDA, LINbus, SCI, SPI, UART/USART
  • Series:MSP430F2xx
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Core Processor:MSP430 CPU16
  • R A M Size:512 x 8
  • Numberof I/ O:32
  • Program Memory Type:Flash
  • Core Size:16-Bit
  • Data Converters:A/D 12x10b
  • Oscillator Type:Internal
  • Program Memory Size:8KB (8K x 8 + 256B)
  • Voltage- Supply( Vcc/ Vdd):1.8V ~ 3.6V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MSP430F2234IDA provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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