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Texas Instruments MSP430AFE233IPW
Manufacturer # :MSP430AFE233IPW
Manufacturer :Texas Instruments
Dasenic # :MSP430AFE233IPW-DS
Datasheet : MSP430AFE233IPW Datasheet
Customer # :
Description : 12 MHz metering AFE with 3 24-bit Sigma-Delta ADCs, 8KB Flash, 512B RAM
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In Stock: 1538
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.744
Total :$ 3.74
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MSP430AFE233IPW information
Texas Instruments MSP430AFE233IPW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontrollers
- Product Status:Active
- Package / Case:24-TSSOP (0.173, 4.40mm Width)
- Peripherals:Brown-out Detect/Reset, PWM, WDT
- Speed:12MHz
- Connectivity:SPI, UART/USART
- Series:MSP430F2xx
- Operating Temperature:-40°C ~ 85°C (TA)
- Core Processor:MSP430 CPU16
- R A M Size:512 x 8
- Numberof I/ O:11
- Program Memory Type:Flash
- Core Size:16-Bit
- Data Converters:A/D 3x24b
- Oscillator Type:Internal
- Program Memory Size:8KB (8K x 8)
- Voltage- Supply( Vcc/ Vdd):1.8V ~ 3.6V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MSP430AFE233IPW provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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